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100%"> <hr> </div><p><strong>主題：基于LS-DYNA的人形機器人仿真探討</strong></p><p><strong>演講嘉賓：</strong></p><p class="ql-align-center"><img src="https://img.jishulink.com/202604/imgs/fcb542aa350441fdb96bf4de47a1c3d7

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[27] Apple Inc. & Nokia Corporation. (2017). "Apple and Nokia Sign Patent License Agreement." 聯合新聞稿。引用位置：第三章3.2節。 [28] Liu, C., et al. (2025).

三大核心挑戰： 信號完整性（SI） ：2.5D/3D封裝下，高密度互連帶來信號串擾、傳輸延遲 電源完整性（PI） ：芯片堆疊導致電源噪聲激增，影響系統穩定性 熱管理：高功耗芯片需要精密散熱設計，熱-電-磁-結構多重耦合 NO.1 征服先進封裝信號與電源挑戰——Ansys SIPI一站式解決方案 核心價值：在先進封裝（如2.5D/3D-IC

><br></p><p class="ql-align-center"><img src="https://picx.zhimg.com/v2-37da217732da0afd9976ab433bcf5e1f_1440w.jpg" data-size="normal" data-rawwidth="866" data-rawheight="523" data-original-token="v2-27b392d6ee1d26a0000745c1b6c146e0

image_process=/format,webp" data-initial-src="https://img.jishulink.com/202602/attachment/e879fa67c07745b4bb34eeb4b3c8f22a.png"> </figure> </figure><p class="ql-align-center"><strong>作品名稱：2.5D/3D設計中的芯片電源網絡分析方案