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The software's ability to model solder joint fatigue, complicate process warpage of 2.5D wafer, drop and vibration test etc. that align with experimental data well.

Assembly Approach[C], //2013 Electronic Components & Technology Conference,2013:5 [13] SONG T, LIM S K, A Fine-Grained Co-Simulation Methodology for IR-drop_SIwave[C]//2011 IEEE 20th Conference

驢所知的生產封裝過程涉及到的EDA工具有DFM，Package Design，OPC。近年來，封裝技術也是一路高歌猛進，在制造進入到『后摩爾時代』后，封裝進入『3D-IC』 時代，也許有一天人類可以造出三體中的智子。

And the good thing for China having the EUV equipment is that the price of the equipment will be significantly dropped. So I guess that would be a benefit of the entire world.

針對于此，本流程中我們在完成簽核的同時，還進行了多項correlation的比對，包括partition-level和 top-level 的IR drop比較，CPA 封裝模型、lumped-RLC模型以及機臺實測下封裝壓降的對比，其結果均顯示前后一致性良好。