③ 導(dǎo)入CFD模型到FEA求解器中實(shí)施最終電熱仿真FEA求解器的PCB板仿真中,打開之前仿真過設(shè)置好的demo.spd文件,在workflow中點(diǎn)擊Set up Thermal Simulation,選擇Generate Simplified CFD Model界面,取消Generate CFD Model的勾選。
toolchain integrated to provide compete EMC solution for ECUs -> EDS -> Antennas ->Vehicle in EMC chamber (Ansys SIwave, HFSS, EMA3D Cable)客戶回報(bào)? 縮短由于EMC 合規(guī)性引起的30% 的上市時(shí)間? Lowerstesting and design costs up
?sDFM Viewer 中的驗(yàn)證狀態(tài)分為五種狀態(tài)(Passed、Failed、Mediocre、Follow up 和 No result),圖標(biāo)如下: ?子項(xiàng)目的狀態(tài)結(jié)合了分析項(xiàng)目的所有驗(yàn)證狀態(tài),主項(xiàng)目狀態(tài)結(jié)合了所有子項(xiàng)目的驗(yàn)證狀態(tài)(主項(xiàng)目和子項(xiàng)目的狀態(tài)不能被調(diào)整),例如:由于壓力(“Pressure)的狀態(tài)顯示為未確認(rèn)(Unconfirmed),因此流動平衡
本文原刊登于Ansys Blog:《Toshiba Speeds Up the Verification of Automotive Semiconductors with Simulation, Model-Based Development, and Digital Twins》 作者:Graziella Alves | Ansys產(chǎn)品營銷經(jīng)理 編輯整理